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Lower bonding

The ECOWRAP wrapping machines with bottom gluing use a flat die-cut in solid board or microflute to automatically form a package around a product. Thanks to an innovative system of folding and gluing from below, this technology ensures optimum hold of the pack, reinforcing its stability during transport and storage.

The principle of lower bonding allows the packaging to be closed at the base, providing a solid hold while improving the aesthetics and compactness of the pack. This method also ensures better palletisation, making handling and logistics easier.